1. 2. 3. material content data sheet sales product name tle7243sl issued 28. august 2013 ma# MA000982076 package pg-ssop-24-7 weight* 147.14 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.128 3.49 3.49 34853 34853 leadframe inorganic material phosphorus 7723-14-0 0.016 0.01 106 non noble metal zinc 7440-66-6 0.062 0.04 423 non noble metal iron 7439-89-6 1.245 0.85 8464 non noble metal copper 7440-50-8 50.568 34.37 35.27 343671 352664 wire noble metal gold 7440-57-5 0.769 0.52 0.52 5224 5224 encapsulation organic material carbon black 1333-86-4 0.171 0.12 1160 plastics epoxy resin - 7.854 5.34 53377 inorganic material silicondioxide 60676-86-0 77.344 52.55 58.01 525648 580185 leadfinish non noble metal tin 7440-31-5 1.680 1.14 1.14 11416 11416 plating noble metal silver 7440-22-4 0.365 0.25 0.25 2482 2482 glue plastics acrylic resin - 0.426 0.29 2899 noble metal silver 7440-22-4 1.512 1.03 1.32 10277 13176 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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